Investigations of metal leaching from mobile phone parts using TCLP and WET methods
Review articleOpen access
Abstract:

Highlights•PWBs and batteries failed TCLP and WET for Pb, Ni, Se, Co, Cu.•Leaching of Se from PWBs in TCLP is a cause of concern.•Order of metals leaching from PWBs is different in WET and TCLP.•TCLP seems to be more aggressive than WET for metal leaching from mobile phones.•Leaching depends on phone part, leaching solution and redox potential of metals.

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