Challenges and directions for testing IC
Review articleOpen access
Abstract:

AbstractIn today's semiconductor world, integration technology is improving and refining dramatically. With the continuous increase of integration densities and complexities, the problem of integrated circuit (IC) testing has become much more acute. IC testing is now no more a back-end issue, rather it has become a front-end burning issue, which needs an economic solution with reliable performance. Otherwise all the benefits of semiconductor technology would be meaningless. A roadmap of semiconductor technology in the context of IC testing is shown in this paper. Researchers and manufacturers can get to know current challenges and directions of IC testing through this discussion.

Request full text

References (0)

Cited By (0)

No reference data.
No citation data.
Advertisement
Join Copernicus Academic and get access to over 12 million papers authored by 7+ million academics.
Join for free!